JOB SUMMARY Timely develop / introduce new products with design for manufacturability, first time qualification success, and competitive cost / differentiation per timeline to meet customer requirements and needs.
This requires heavy involvement with factory teams.
Define package requirements based on product groups and customer applications and inputs. Risk mitigation, BOM selection and die layout review.
Participate in new package / platform development. File for IP on new patentable developments.
Perform package cost effectiveness studies as required by project program.
Timely develop / introduce new products with DFM and first time qualification success.
Drive optimization and perform proof of principles on existing / newly developed platform / product.
Design / develop / search packaging features to meet new product requests. Demonstrate Logical and systematic search capabilities.
Communicate clearly and precisely with team members and attend project team meeting as needed.
Multi task and handle numerous projects at the same time.
Performs other duties as required by immediate manager.
Engineer will be responsible for working closely with chip design teams, and helping to translate their needs into packaging designs, concepts, and constructions, as well as, optimize both the chip and the package to drive to the best total design solution.
Package design gets involved very early in the planning stages for new product and works closely with silicon design to have the earliest influence possible and the greatest impact.
This early involvement is followed by the detailed design activities for the chip and the package, working in conjunction with each other during the parallel development of the silicon process, the chip design, and the package design.
Work with multi business and factory organizations to ensure requirements are properly captured and delivered.