1. BS, MS or PhD in science or engineering fields with minimum 8 years of experience in semiconductor (Fab, Substrate, Assembly) development or manufacturing environment is required.
2. Strong skill required for supplier management, quality management, analytical problem solving, and influence in relevant fields of HVM.
3. In-depth knowledge required on substrate manufacturing processes and warpage related Assembly / Test / Substrate interaction, raw material warpage interaction, packaging technologies, and quality and process control system.
4. Fluent communication and articulation skills in business level English, strong presentation skills and ability to effectively communicate and interact with internally and supplier's management highly required.
5. Strong ability to work in cross functional teams are required.